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W25Q32JVXGIM

Part No W25Q32JVXGIM
Manufacturer Winbond Electronics Corporation
Description
Lead Free Status / RoHS Status Contains lead /RoHS non-compliant
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Specifications

Data sheet

Program Current (mA)25
PCB changed8
HTS8542.32.00.71
ECCN (US)3A991.b.1.a
Programming Voltage (V)2.7 to 3.6
PPAPNo
Operating Current (mA)25
AutomotiveNo
Command CompatibleYes
Address Bus Width (bit)24
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Supplier PackageXSON EP
Chip Density (bit)32M
Timing TypeSynchronous
Package Height0.43
Maximum Operating Supply Voltage (V)3.6
EU RoHSCompliant
Maximum Programming Time (ms)3/Page
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Sector Size4Kbyte x 1024
Boot BlockYes
Number of Words4M
Number of Bits/Word (bit)8
ECC SupportNo
Location of Boot BlockTop|Bottom
ArchitectureSectored
Block OrganizationSymmetrical
Support of Page ModeNo
Page Size256byte
Minimum Endurance (Cycles)100000
Package Length4
Supplier Temperature GradeIndustrial
Cell TypeNOR
Pin Count8
MountingSurface Mount
Max. Access Time (ns)6
PackagingTube
Part StatusActive
Typical Operating Supply Voltage (V)3.3|3
Package Width4
Maximum Erase Time (S)50/Chip
ProgrammabilityYes
Minimum Operating Supply Voltage (V)2.7

Introduce

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