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EPC2025ENGR

Part No EPC2025ENGR
Manufacturer EPC
Description TRANS GAN 300V 4A BUMPED DIE
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

Drain to Source Voltage (Vdss):300V
Power Dissipation (Max):-
Package / Case:Die
Mounting Type:Surface Mount
Packaging:Tray
Supplier Device Package:Die Outline (12-Solder Bar)
Vgs(th) (Max) @ Id:2.5V @ 1mA
Drive Voltage (Max Rds On, Min Rds On):5V
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:N-Channel 300V 4A (Ta) Surface Mount Die Outline (12-Solder Bar)
FET Feature:-
Moisture Sensitivity Level (MSL):1 (Unlimited)
Email:info@chipdigger.com
FET Type:N-Channel
Series:eGaN®
Current - Continuous Drain (Id) @ 25°C:4A (Ta)
Other Names:917-EPC2025ENGR EPC2025ENGRC
Input Capacitance (Ciss) (Max) @ Vds:194pF @ 240V
Vgs (Max):+6V, -4V
Rds On (Max) @ Id, Vgs:150 mOhm @ 3A, 5V
Technology:GaNFET (Gallium Nitride)
Gate Charge (Qg) (Max) @ Vgs:1.85nC @ 5V
Operating Temperature:-40°C ~ 150°C (TJ)

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