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K4B4G1646D-BIH9

Part No K4B4G1646D-BIH9
Manufacturer Samsung Semiconductor
Description
Lead Free Status / RoHS Status Contains lead /RoHS non-compliant
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Specifications

Data sheet

Organization256Mx16
PCB changed90
ECCN (US)EAR99
PPAPNo
Data Bus Width (bit)16
Operating Current (mA)103
Number of Internal Banks8
AutomotiveNo
Address Bus Width (bit)18
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)95
Supplier PackageFBGA
DRAM TypeDDR3 SDRAM
Chip Density (bit)4G
Number of Words per Bank32M
Maximum Operating Supply Voltage (V)1.575
Maximum Clock Rate (MHz)1333
EU RoHSCompliant
Maximum Access Time (ns)0.255
Interface TypeSSTL_1.5
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Package Length13.3
Supplier Temperature GradeIndustrial
Standard Package NameBGA
Pin Count90
MountingSurface Mount
Lead ShapeBall
Part StatusUnconfirmed
Typical Operating Supply Voltage (V)1.5
Package Width7.5
Minimum Operating Supply Voltage (V)1.425

Introduce

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